Integrated Silicon Microwave and Millimeterwave Passive Components and Functions

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Conception et Réalisation de filtres RF passe-bas à structures périodiques et filtres Ultra Large Bande, semi-localisés en technologie planaire

In recent years, extensive research and development efforts have been put into exploiting planar filters for their potential qualities of low cost, tiny weight and high degree of integration. The aim of the research work presented in this manuscript is the design and the realization of selective and miniaturized planar filters. A new topology of compact low-pass filter with periodic structures, constituted by a transmission line loaded by SMT capacitors, is proposed. A rigorous design method for the low-pass filter is also implemented. The measurements of the low-pass filters, realized near to 1 GHz in a CPW technology, in good agreement with simulations demonstrated interesting electrical proprieties of rejection, matching and spurious suppression. The validity of this topology is also investigated for higher frequencies with the realization of a low-pass filter in the X-band. Several capacitor's characterization approaches were also investigated. The implementation of capacitors in a low pass filter with periodic structure carried out constitutes the most precise way to characterize capacitors. A new topology of Ultra Wide Band band-pass filters, based on the combination of a high pass filter with short circuited stubs and a low pass filter with capacitively loaded lines, is proposed. The measurements of the prototype filters realized in a microstrip technology, in good agreement with simulations, show interesting proprieties of selectivity, miniaturization and spurious suppression.La technologie planaire constitue une technologie attrayante pour la réalisation de filtres, en terme de coût, de volume, ainsi que des possibilités d'intégration. Dans ce contexte, le développement de filtres planaires sélectifs et peu encombrants est à l'heure actuelle un domaine d'activité d'un intérêt fondamental. Les travaux présentés dans ce manuscrit s'inscrivent dans cet axe de recherche. Après un état de l'art sur les différentes familles de filtres planaires, une nouvelle topologie de filtre passe-bas compact, constituée d'une ligne de propagation périodiquement chargée par des capacités CMS, est développée. Une méthode rigoureuse de conception est développée et des démonstrateurs hybrides en technologie CPW à 1 GHz sont réalisés. Les mesures, en très bon accord avec les simulations, valident des propriétés intéressantes en terme de réjection, d'adaptation et de remontées parasites. La montée en fréquence est également explorée par la réalisation d'un filtre passe-bas en bande X. Les résultats montrent la nécessité d'une caractérisation fine des capacités. Ensuite, une méthode de caractérisation des capacités est mise en oeuvre. Il s'avère que l'insertion des capacités dans des filtres passe-bas à structure périodique constitue un moyen précis et fiable de modélisation. Une topologie de filtre passe-bande à Ultra Large Bande, basée sur une imbrication d'un filtre passe-haut à stubs dans un filtre passe-bas à lignes capacitivement chargées, est mise en place. Les mesures des prototypes en technologie micro-ruban, en bon accord avec les simulations, montrent des propriétés intéressantes de sélectivité, de miniaturisation et de rejet de lobes secondaires

RFID potential impacts and future evolution for green projects

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Time domain design for UWB filters

International audienc

Transformation of Barcode Into RFID Tag, Design, and Validation

International audienc

3D antenna for UHF RFID Tag On Molded interconnect device

International audienceAn original design of 3D-MID antenna for passive UHF RFID tags is presented in this paper. For the first time the integration of RFID tag into the MID technology is considered. The novel tag based on a meander antenna and placed on the external face of a thermoplastic cylinder (LCP Vectra E820i) is compatible with Laser Direct Structuring (LDS) process. Both planar and 3D designs on MID substrate are discussed. In particular the influence of the 3D implementation on the RFID Tag performance is studied. Simulation results confirm the potential of this 3D design

Molded interconnect devices for RF applications: Transmission lines and low pass filters

International audienceThe continual trend of miniaturization and increasing complexity in the field of Radio Frequency (RF) devices poses a challenge for today's manufacturing technologies. The possibility of miniaturization of RF components with Molded Interconnect Devices (MIDs) is very attractive. However, electromagnetic properties of MID substrates based on polymer materials and behavior of RF basic components designed on MID substrates are not well known in the literature. In this paper, some MID substrates complex permittivity measurements and dielectric losses measurements are presented and exploited to design RF basic components. LCP Vectra E820i is used for the realization of transmission lines and a low pass filter in Coplanar Waveguide (CPW) technology by Laser Direct Structuring (LDS). Measurements, which are in good agreement with simulations, make MIDs good candidates for RF applications

Time domain design for ultra wideband filters

International audienceIn this article, a time domain method for designing microstrip-line ultra wideband passband filters is presented.From the filter expected specifications, the profile of the nonuniform transmission line is calculated analytically. The filter presented in this article illustrates the proposed method and emphasizes its potential. © 2011 Wiley Periodicals, Inc. Microwave Opt Technol Lett 53:1006-1011, 2011; View this article online at wileyonlinelibrary.com. DOI 10.1002/mop.2592

Microstrip transmission lines and antennas on Molded Interconnect Devices materials

International audienceIn this paper, microstrip transmission lines and antennas realized on Molded Interconnect Devices (MIDs) are presented. Measurements of two transmission lines realized by LDS on LCP vectra E820i substrate and inkjet printing on ABS PC substrates allowed the extraction of LCP vectra E820i and ABS PC permittivities. Measurement results show that lower losses are obtained with the LDS fabrication technique, validating thus the potential of MIDs for RF applications. The measurement results of the two microstrip patch antennas realized by Laser Direct structuring (LDS) on LCP vectra E820i substrate and inkjet printing on ABS PC substrate are made in good agreement with simulations